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High precision non-contact solutions for AOI of any substrate size and thickness

Unmatched process zone accuracy and temperature uniformity solutions

High precision and optimal air flow uniformity for mura-free processes

Combined pressure and vacuum technologies for reliable curing of any substrate size and thickness

Unique, reliable wafer active- and back-side clamping solution that eliminates back-side contamination

Advanced ultra-thin wafer handling solutions for WLP/FOWLP processes

Reliable handling of highly warped wafers enables high process throughput

Acquiring and flattening of highly warped wafers at any size and thickness

Acquiring and flattening of highly warped wafers at any size and thickness

Acquiring and flattening of highly warped panels (PLP) and substrates at any size and thickness