Innovative handling solutions to accelerate performance and improve quality & yield

The Flat Panel Display (FPD) Market

The Flat Panel Displays are thin and lightweight display screens that are used in laptops, monitors, televisions, smartphones, digital cameras, and other portable devices. Flat-panel size requirement varies as per the end device on which it is mounted. With the introduction of more innovative technology-based solutions, flat panel displays can be found in the majority of consumer and industrial display systems.

Today flat panel displays mostly use LCD (liquid crystal display) technology but in recent years there is a shift toward the use of the organic light-emitting diode display (OLED) technology which is gaining large momentum. OLED displays are not just thinner and more efficient than LCD displays - they provide superior image quality and they can also be made transparent, flexible, foldable, rollable, and stretchable.

Driven by end-user demands for increased product quality and lower costs, FPD manufacturers are constantly searching for improved processes and fab automation equipment. In addition, larger (G8 to G11) and thinner glass (<0.4mm) substrates are more complex to process and present ongoing precision and handling challenges for equipment manufacturers.

CoreFlow addresses these challenges by providing high-performance floating solutions that handle and convey glass substrates of any size and weight with maximum reliability, precise Z positioning, glass flatness, and with minimal maintenance requirements. Our solutions are used by many leading fabs worldwide.

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The Semiconductor Industry

Semiconductor devices are the beating heart of almost every electronic product. These devices rely on the electronic properties of semiconductor material. The devices are manufactured both as single discrete components and as ICs that integrate millions or even billions of transistors (!), manufactured and interconnected on a single semiconductor wafer (also known as a substrate). The constantly increasing demand for more computing power and memory on smaller devices, and a lower rate of energy consumption, drives the wafer manufacturing process to the limit. Sensitivity to process cleanliness drives efforts to achieve particle reduction, while the push for thinner substrates has led to increased levels of warping – and new challenges in wafer handling.

CoreFlow addresses these challenges by providing non-contact chucks that handles semiconductor wafers without any contact, and selective vacuum products that are specifically designed to handle warped and/or odd shape wafers.

CoreFlow’s non-contact and selective vacuum products are adopted by major semiconductor equipment manufacturers in three different continents.

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