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Motion Systems
High precision non-contact solutions for AOI of any substrate size and thickness
Unmatched process zone accuracy and temperature uniformity solutions
High precision and optimal air flow uniformity for mura-free processes
Combined pressure and vacuum technologies for reliable curing of any substrate size and thickness
Unique, reliable wafer active- and back-side clamping solution that eliminates back-side contamination
Advanced ultra-thin wafer handling solutions for WLP/FOWLP processes
Reliable handling of highly warped wafers enables high process throughput
Acquiring and flattening of highly warped wafers at any size and thickness
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