CoreFlow HQ, Israel, July 14, 2021. CoreFlow Ltd., a leading supplier of advanced aeromechanical handling and conveying solutions, published the findings of its energy-cost research with regards to the use of its SmartNozzleTM air-floating technology for the conveyance of semiconductor and flat-panel display substrates.
In the recently published article, CoreFlow compared the power consumption requirements of its handling systems with those of alternative technologies - porous based air bars and drilled-hole air bars - and concluded that SmartNozzleTM - based systems consumed up to 77% less energy than its alternatives.
“The article signals the start of our campaign to increase energy-use awareness in the FPD and semiconductor manufacturing communities,” said Ami Herman, CoreFlow’s CEO. “As 'green' considerations become a priority in the industry, manufacturers can look in this direction to reduce operating expenses as well.
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About CoreFlow Ltd.
CoreFlow is an industry leader in high-precision, air-floating solutions for critical processes in the Semiconductor and FPD industries. The company develops, manufactures, and markets handling, conveying, and processing systems used by key equipment manufacturers around the globe.