SmartNozzle™ 是我们的专家团队开发的各种基于气流的专利技术的核心。我们将这些技术转化为数百种经过现场验证的处理解决方案，可提供最高水平的质量和性能。
SmartNozzle™ technology is at the heart of CoreFlow's non-contact air floating solutions. Thanks to its vertical flow pattern and innovative aerodynamic design, SmartNozzle™ precisely controls the flo... Read More >>
The growing demand for thin and flat panel displays has led FPD manufacturers to push for increased production yields. As a result, glass substrates have become larger – in order to improve efficiency... Read More >>
CoreFlow’s Selective Vacuum (SV) solution addresses the challenges of handling warped substrates. When a warped substrate is placed on a selective vacuum chuck or a stage, some of the vacuum ports (pa... Read More >>
Some critical FPD manufacturing processes, such as OLED inkjet printing or photoresist coating, can cause leakage of material onto pressure/vacuum (PV) handling stages. Leakage of materials may cause... Read More >>
Based on its key technology, the SmartNozzleTM, CoreFlow has developed a set of advanced aeromechanical solutions to address the most rigorous requirements of substrate handlings in the FPD, Semicondu... Read More >>
Motion Systems
High precision non-contact solutions for AOI of any substrate size and thickness
Unmatched process zone accuracy and temperature uniformity solutions
High precision and optimal air flow uniformity for mura-free processes
Combined pressure and vacuum technologies for reliable curing of any substrate size and thickness
Unique, reliable wafer active- and back-side clamping solution that eliminates back-side contamination
Advanced ultra-thin wafer handling solutions for WLP/FOWLP processes
Reliable handling of highly warped wafers enables high process throughput
Acquiring and flattening of highly warped wafers at any size and thickness
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