CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

CoreFlow’s innovative Selective Vacuum technology was recently selected by a major semiconductor inspection machine manufacturer to serve as its handling platform. 

Selective Vacuum enables effective and reliable handling of semiconductor wafers in applications where the wafers are often of irregular shape and thickness. “Semiconductor back-end, offline applications such as this, represent a real challenge to our customers and therefore an opportunity for us,” said Ami Herman, Core Flow’s VP of Sales and Marketing.“CoreFlow was selected by an inspection machine manufacturer following a long and comprehensive collaborative process, in which we were able to address our customer’s challenges in an optimal way.  Our product was compared with the competition in terms of handling reliability, cleanliness, simplicity, and price.”  “At CoreFlow, we keep are constantly striving to offer unique solutions that help semiconductor manufacturers to increase uptime, yield, and improve ROI.”

About CoreFlow Ltd.

CoreFlow provides high-precision, air-floatation solutions for critical processes in the Semiconductor, FPD, and other industries. The company develops, manufactures, markets, and supports handling, conveying, and processing systems used by key equipment manufacturers around the globe.


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