CoreFlow Unveils a 310 mm × 310 mm Vacuum Chuck to Solve Critical Warpage Challenges in CoPoS Panel-Level Packaging

Engineered for precise, clamp-free flattening of highly warped glass substrates and seamless integration with existing fab metrology, lithography, and inspection systems

DALIAT-EL CARMEL, Israel,  Dec. 16, 2025,  CoreFlow Ltd., a global provider of high-accuracy aerodynamic handling solutions for the semiconductor industry, today announced its next-generation Vacuum Chuck for warped panel handling and flattening, designed for advanced CoPoS (Chip-on-Panel-on-Substrate) packaging processes.

CoPoS substrates provide up to 81% more usable area compared to traditional 300 mm wafers, supporting higher device density and improved manufacturing efficiency for advanced AI-driven applications.

Derived from CoreFlow’s fab-proven vacuum chucks currently used in 300mm wafers CoPoW process flows, the new 310 mm × 310 mm stage is designed to support next-generation CoPoS panel-level packaging requirements.

Industry Leadership Perspective

“Substrate warpage has become one of the industry’s most critical manufacturing challenges,”  said Alon Segal, CEO of CoreFlow. “Building on our fab-proven experience with silicon wafers and glass substrates, the new 310 mm × 310 mm PLP vacuum stage integrates advanced aeromechanical design for accurate, clamp-free flattening. With interfaces compatible with standard fab utilities, the stage supports efficient integration into existing metrology, lithography, and inspection systems for advanced CoPoS panel-level packaging.”

The new 310 mm × 310 mm stage is now available for order in Selective Vacuum or GripJet configurations, with optional surface finishing, ESD coating, and lift-pin assemblies. Customer-specific modifications are supported, with typical delivery lead times of 8 to 12 weeks.

About CoreFlow Ltd.

CoreFlow Ltd. (www.coreflow.com ) is a leading developer and manufacturer of advanced substrate-handling systems for the semiconductor, FPD & Solar industries. Founded in 1999, CoreFlow has been at the forefront of aeromechanical innovation, with patented handling technologies deployed globally. The company’s headquarters and R&D center are located in Daliat-El Carmel, Israel, with manufacturing, sales, and customer-support operations in Korea, Taiwan, Japan, and China.   

For more information or to schedule a technical briefing, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  or our local distributors.

Figure 1: CoreFlow's new  Selective Vacuum Chuck for Precision flattening of  310 X 310 mm warped panels

PRNewsWire: https://www.prnewswire.com/news-releases/coreflow-unveils-new-310-mm-O-310-mm-vacuum-stage-to-solve-major-warpage-challenges-in-copos-panel-level-packaging-302643721.html

The Yahoo post: https://finance.yahoo.com/news/coreflow-unveils-310-mm-310-165000824.html

Media & Sales Contacts:

• Mr. Alon Kapel, VP BD, Sales & Marketing, CoreFlow Ltd. This email address is being protected from spambots. You need JavaScript enabled to view it.
• Mr. Gaspard Hsieh, Asea Technical Support Manager. This email address is being protected from spambots. You need JavaScript enabled to view it.