DALIAT-EL CARMEL, Israel, Nov. 28, 2023 -- CoreFlow Ltd, a leading provider of advanced aeromechanical solutions for the Semiconductors and FPD industries, today announced the launch of its new GripJet™ Vacuum Chuck for Handling Highly Warped Wafers without the need for soft pad elastomers or mechanical flattening mechanism.
Empowered by innovative vacuum enhancement technology, the GripJet™ Vacuum chuck delivers superior grip strength that firmly secures and flattens highly warped wafers, making it ideal for warped wafers inspection and other key manufacturing applications where wafer flatness is essential.
The GripJet™ vacuum chuck is particularly well-suited for advanced wafer-level packaging (AWLP), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) processes, and various semiconductor processes that require precise and reliable handling of warped wafers.
"We are thrilled to introduce the GripJet™, a groundbreaking vacuum chuck" declared Mr. Alon Segal, CoreFlow CEO. "The GripJet™ tackles a critical challenge in the semiconductor industry, and we are confident that it will empower our customers worldwide to boost yields, lower costs, and expedite cycle times, particularly for sophisticated wafer-level packaging processes." Mr. Segal added, "We are committed to continuous innovation and providing advanced aeromechanic solutions for the semiconductors industry".
Media press release: PR Newswire
For GripJet™ Wafer Chuck product page Warped Wafer Flattening with GripJet™ Chuck
For GripJet™ Stage product page Warped Panels Flattening with GripJet™ Stage
GripJet™ vacuum stage for flattening highly warped panels and substrates GripJet™ vacuum Chuck for flattening highly warped semiconductor wafers