The SmartNozzle™ is at the heart of a wide range of patented, flow-based technologies developed by our team of experts. We have turned these technologies into hundreds of field-proven handling solutions that provide the highest levels of quality and performance.
SmartNozzle™ technology is at the heart of CoreFlow's non-contact air floating solutions. Thanks to its vertical flow pattern and innovative aerodynamic design, SmartNozzle™ precisely controls the flo... Read More >>
The growing demand for thin and flat panel displays has led FPD manufacturers to push for increased production yields. As a result, glass substrates have become larger – in order to improve efficiency... Read More >>
CoreFlow’s Selective Vacuum (SV) solution addresses the challenges of handling warped substrates. When a warped substrate is placed on a selective vacuum chuck or a stage, some of the vacuum ports (pa... Read More >>
Some critical FPD manufacturing processes, such as OLED inkjet printing or photoresist coating, can cause leakage of material onto pressure/vacuum (PV) handling stages. Leakage of materials may cause... Read More >>
Based on its key technology, the SmartNozzleTM, CoreFlow has developed a set of advanced aeromechanical solutions to address the most rigorous requirements of substrate handlings in the FPD, Semicondu... Read More >>
Combined pressure and vacuum technologies for reliable curing of any substrate size and thickness
Unique, reliable wafer active- and back-side clamping solution that eliminates back-side contamination