Driven by the high requirements of wafer handling, CoreFlow addresses the challenges of reducing back side contamination and handling thin and flexible wafers, for various applications within the semiconductor process. 

CoreFlow’s air floating solution could be integrated into inspection, metrology and other semiconductor process systems, providing consistent and reliable handling of wafers with no contact neither at the back nor front side.


OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

side info

side info