Driven by the high requirements of wafer handling, CoreFlow addresses the challenges of reducing backside contamination and handling thin and flexible wafers, for various applications within the semiconductor process. 

CoreFlow’s air floating solution could be integrated into inspection, metrology, and other semiconductor process systems, providing consistent and reliable handling of wafers with no contact neither at the back nor front side.

 

Non-Contact Chuck

CoreFlow's Non-Contact Chuck addresses the challenges of reducing backside contamination and handling thin and flexible wafers, for various applications within the semiconductor process... read more

 

Selective Vacuum 

CoreFlow’s selective vacuum solution addresses the challenges of handling warped wafers. Utilizing its SmartNozzle® technology, CoreFlow’s handling mechanism acquires the wafer even when only a fraction of the vacuum array is covered ... read more

 

Robot End Effector

CoreFlow’s End Effector (EE) family addresses the challenges of handling all types of wafers, including thin, perforated, compound, glass, bare and polish wafers ... read more

 

 

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OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

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