CoreFlow’s solution for flexible substrate allows :

  • Vertical axis flattening capability of ±5μm - ±25μm depending on web material, thickness and tension
  • Non-contact between web and aero-mechanical surfaces ensuring no bottom-side contamination or mechanical damage to the web
  • Maintaining tension uniformity along the web in conjunction with the R2R system
  • Ability to control the web temperature through conductive heating from aeromechanical surfaces via very thin air layers
  • Uniform temperature distribution – no hot spots
  • Fast thermal response due to a relatively small air gap
  • Thermal decoupling of media from the support system
  • Can be operated under vacuum conditions (down to 20 Torr. abs.)

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

side info

side info