CoreFlow’s solution for flexible substrate allows :

  • Vertical axis flattening capability of ±5μm - ±25μm depending on web material, thickness and tension
  • Non-contact between web and aero-mechanical surfaces ensuring no bottom-side contamination or mechanical damage to the web
  • Maintaining tension uniformity along the web in conjunction with the R2R system
  • Ability to control the web temperature through conductive heating from aeromechanical surfaces via very thin air layers
  • Uniform temperature distribution – no hot spots
  • Fast thermal response due to a relatively small air gap
  • Thermal decoupling of media from the support system
  • Can be operated under vacuum conditions (down to 20 Torr. abs.)

Please leave your details to be contacted by CoreFlow solutions specialist:

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

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