Join CoreFlow Ltd. for SEMICON West 2020, A New and Exciting Online Event.
Our virtual booth is open 24/7 starting July 20th, 2020.
We will present our innovative solutions for the Semiconductors equipment industry: Non-Contact chuck, Selective Vacuum, Robot End Effector. Schedule a virtual meeting with our experts to learn more about our advanced solutions and their endowment, to the critical Semiconductors processes.
CoreFlow addresses the challenges of reducing backside contamination and the challenges of handling thin and flexible wafers, for various applications within the semiconductor process. CoreFlow’s air floating solution could be integrated into inspection, metrology, and other semiconductor process systems, providing consistent and reliable handling of wafers with no contact neither at the back nor front side of the wafers.
CoreFlow's Non-Contact Chuck addresses the challenges of reducing backside contamination and handling thin and flexible wafers, for various applications within the semiconductor process... read more
CoreFlow’s selective vacuum solution addresses the challenges of handling warped wafers. Utilizing its SmartNozzle® technology, CoreFlow’s handling mechanism acquires the wafer even when only a fraction of the vacuum array is covered ... read more
for a free reservation to the SEMICON West 2020 Virtual Event