Join CoreFlow Ltd. for SEMICON West 2020, A New and Exciting Online Event.

Our virtual booth is open 24/7 starting July 20th, 2020.

 

We will present our innovative solutions for the Semiconductors equipment industry: Non-Contact chuck, Selective Vacuum, Robot End Effector. Schedule a virtual meeting with our experts to learn more about our advanced solutions and their endowment, to the critical Semiconductors processes.

 

Click here for free registration to SEMICON West 2020 Virtual Event

 

 

About us

CoreFlow addresses the challenges of reducing backside contamination and the challenges of handling thin and flexible wafers, for various applications within the semiconductor process.  CoreFlow’s air floating solution could be integrated into inspection, metrology, and other semiconductor process systems, providing consistent and reliable handling of wafers with no contact neither at the back nor front side of the wafers.

 

 

 

Non-Contact Chuck

CoreFlow's Non-Contact Chuck addresses the challenges of reducing backside contamination and handling thin and flexible wafers,  for various applications within the semiconductor process... read more

Selective Vacuum

CoreFlow’s selective vacuum solution addresses the challenges of handling warped wafers. Utilizing its SmartNozzle® technology, CoreFlow’s handling mechanism acquires the wafer even when only a fraction of the vacuum array is covered ... read more

Robot End Effector

CoreFlow’s End Effector (EE) family addresses the challenges of handling all types of wafers, including thin, perforated, compound, glass, bare and polish wafers ... read more

 

 

 

 

 

 

 

 

for a free reservation to the SEMICON West 2020 Virtual Event

 

 

 

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

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