CoreFlow's HQ, Nov 20, 2019 – CoreFlow will exhibit at SEMICON Japan, its advance solutions for non-contact handling in the Semiconductor and FPD industries. The show will take place Tokyo Big Sight, Tokyo, Japan on Dec 11-13, 2019.


Please come visit our booth: #2455 in West Exhibition Hall 1, to see a live demo of our advance solutions.


CoreFlow will participate in the Exhibitor Seminar in SEMICON Japan 2019, presenting "Advanced Technologies For Reliable Warped Wafer Handling".   The presentation will be held in the Exhibitor Seminar Room 1(West 1 Meeting Room) on Friday, Dec 13, 2019, between 11:20 to 12:10 .     


About CoreFlow Ltd.

CoreFlow is an industry leader in high precision air-floating solutions for critical processes in the Semiconductor and FPD industries. The company develops, manufactures and markets handling, conveying and processing systems used by key equipment manufacturers around the globe.


About SEMICON Japan

SEMICON Japan takes place in the heart of the semiconductor supply chain with more than 750 exhibiting companies from Japan and other regions, showcasing innovative solutions for your technology challenges and business success more about.

Please leave your details to be contacted by CoreFlow solutions specialist:

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

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