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DALIAT-EL CARMEL, Israel, Sept. 19, 2024 /PRNewswire/ -- CoreFlow Ltd., a leading supplier of innovative vacuum stages for the semiconductors and FPD industries, today announced the launch of the GripJet™ vacuum stage for handling and flattening highly warped panels for the emerging Fan-out Panel Level Packaging (FOPLP) high-volume production lines.
According to Brad Perkins, product line director at Nordson Test & Inspection. "Glass substrates have their own sets of challenges. When you look at a 500-plus millimeter square for those large glass panels, you run into some challenges with how much that bends and warps, and then how do you hold them?"
The GripJet™ vacuum stage employs the SmartNozzle™ selective vacuum technology with a patent-pending GripJet flow amplifier to generate a powerful vacuum force, effectively gripping and flattening highly warped panels into a flat stage. This innovative vacuum stage technology eliminates the reliance on traditional soft vacuum pads, mechanical clamping mechanisms, or the use of huge vacuum pumps (as often needed for standard vacuum stages) resulting in enhanced productivity, reduced breakage, reduced cost, improved yield, and increased tool uptime.
Live https://youtu.be/PeBkpkZmgqQ
The GripJet™ vacuum stage is available for standard industry panel sizes such as 510 mm X 515 mm and other customized sizes for Glass and copper-clad flat panels of various thicknesses and warpages. The GripJet™ stage was designed for seamless integration into existing production tools with 3 mechanical contact points, four 10 mm standard vacuum tubes, and one CDA input. Optional edge exclusion version and lift pins mechanism are available on request.
"We are thrilled to be among the first in the market to offer an efficient, production-ready solution for the emerging panel-level packaging market," said Alon Kapel, Vice President of Sales and Marketing at CoreFlow. "The GripJet™ vacuum stage gives tools manufacturers a time-to-market advantage by providing a straightforward, easy integration and field-proven solution for handling and flattening highly warped panels with easy integration into FOPLP metrology, inspection (AOI), and various atmospheric process tools. CoreFlow also provides build-to-print GripJet™ stages, ensuring optimal integration into the OEM environment.
PLP GripJet Video Demonstration:
- Thickness: 0.3 mm | Panel Size: 510 x 515 mm | Warpage: 25 mm: Video Link https://youtu.be/4JPwtO4I75k
- Thickness: 1.2 mm | Panel Size: 510 x 515 mm | Warpage: 10 mm: Video Link https://youtu.be/Lvtyj3ygLTA
- Thickness: 2.0 mm | Panel Size: 510 x 515 mm | Warpage: 6 mm: Video Link https://youtu.be/eONt9DccC4o
DALIAT-EL CARMEL, Israel, Nov. 28, 2023 -- CoreFlow Ltd, a leading provider of advanced aeromechanical solutions for the Semiconductors and FPD industries, today announced the launch of its new GripJet™ Vacuum Chuck for Handling Highly Warped Wafers without the need for soft pad elastomers or mechanical flattening mechanism.
Empowered by innovative vacuum enhancement technology, the GripJet™ Vacuum chuck delivers superior grip strength that firmly secures and flattens highly warped wafers, making it ideal for warped wafers inspection and other key manufacturing applications where wafer flatness is essential.
The GripJet™ vacuum chuck is particularly well-suited for advanced wafer-level packaging (AWLP), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) processes, and various semiconductor processes that require precise and reliable handling of warped wafers.
"We are thrilled to introduce the GripJet™, a groundbreaking vacuum chuck" declared Mr. Alon Segal, CoreFlow CEO. "The GripJet™ tackles a critical challenge in the semiconductor industry, and we are confident that it will empower our customers worldwide to boost yields, lower costs, and expedite cycle times, particularly for sophisticated wafer-level packaging processes." Mr. Segal added, "We are committed to continuous innovation and providing advanced aeromechanic solutions for the semiconductors industry".
Media press release: PR Newswire
For GripJet™ Wafer Chuck product page Warped Wafer Flattening with GripJet™ Chuck
For GripJet™ Stage product page Warped Panels Flattening with GripJet™ Stage
GripJet™ vacuum stage for flattening highly warped panels and substrates GripJet™ vacuum Chuck for flattening highly warped semiconductor wafers
We're excited to attend SEMICON Taiwan on September 14-16, 2022.
Be sure to visit our booth #N1066 (4th floor) to discover our innovative solutions for risk-free and zero particle handling of standard and warped wafers
CoreFlow recently attended the Samsung InkJet Printing Core Technology Seminar 2023 in Korea.
In this seminar, only a selected number of companies with excellent technology are invited to introduce their technology directly to Samsung executives and employees from the printing inkjet division, and CoreFlow is proudly one of them.
CoreFlow CEO, Mr. Alon Segal presented our latest innovative technology solutions in the FPD and Semiconductor markets, to a wide audience of engineers and managers, building strong collaboration between the two companies.
Building collaboration with Samsung, a major player in the FPD industry, is leading to opportunities for partnerships, collaborations, and integration of CoreFlow's solutions into Samsung's products or processes.
This seminar is a significant step in raising CoreFlow's profile, establishing connections, and potentially opening doors for future business growth and innovation at Samsung.
CoreFlow CEO Mr. Alon Segal at the Samsung InkJet Printing Seminar
We're excited to attend SEMICON Taiwan on September 14-16, 2022.
Be sure to visit our booth #N1066 (4th floor) to discover our innovative solutions for risk-free and zero particle handling of standard and warped wafers
