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<loc>https://www.coreflow.com/en/solutions/semiconductor-industry/selective-vacuum-handling-2</loc>
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<video:thumbnail_loc>https://i.ytimg.com/vi/YAIoqnddWX4/hqdefault.jpg</video:thumbnail_loc>
<video:title>CoreFlow solution for clamping and flattening warped semiconductor wafers</video:title>
<video:description><![CDATA[CoreFlow selective vacuum chuck attaches to warped wafers, even when only a fraction of the pads are covered, there is enough vacuum force to hold the wafer.
CoreFlow selective vacuum chuck can handle thin and thick (100-1400μm) warped wafers (supporting warpage of up to 10 mm).]]></video:description>
<video:player_loc allow_embed="yes" autoplay="ap=1">https://www.youtube.com/embed/YAIoqnddWX4</video:player_loc>
<video:duration>60</video:duration>
<video:publication_date>2022-02-19T22:16:16+00:00</video:publication_date>
<video:live>no</video:live>
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