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<loc>https://www.coreflow.com/en/solutions/semiconductor-industry/selective-vacuum-handling-2</loc>
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<video:title>CoreFlow solution for clamping and flattening warped semiconductor wafers</video:title>
<video:description><![CDATA[CoreFlow selective vacuum chuck attaches to warped wafers, even when only a fraction of the pads are covered, there is enough vacuum force to hold the wafer.
CoreFlow selective vacuum chuck can handle thin and thick (100-1400μm) warped wafers (supporting warpage of up to 10 mm).]]></video:description>
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<video:duration>60</video:duration>
<video:publication_date>2022-02-19T22:16:16+00:00</video:publication_date>
<video:live>no</video:live>
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</url>
<url>
<loc>https://www.coreflow.com/en/solutions/factory-automation/vpw-motion-system</loc>
<video:video>
<video:thumbnail_loc>https://i.ytimg.com/vi/yx_TuSsgwlM/hqdefault.jpg</video:thumbnail_loc>
<video:title>CoreFlow V-Wheels Motion System on Air Bars, for substrates conveying</video:title>
<video:description><![CDATA[CoreFlow's V-Wheels Motion System performs fast, accurate substrate 
conveyance, offering minimal contact with the substrate surface.

For more details visit: https://www.coreflow.com/technology/vpw-motion-system

Vist us at our website @ www.coreflow.com]]></video:description>
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<video:duration>72</video:duration>
<video:publication_date>2020-04-30T14:34:46+00:00</video:publication_date>
<video:live>no</video:live>
</video:video> 
</url>
<url>
<loc>https://www.coreflow.com/en/semiconductors-solution-tem</loc>
<video:video>
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<video:title>CoreFlow's solutions for critical semiconductor process</video:title>
<video:description><![CDATA[Short video animation that explain CoreFlow's solutions offering for the Semiconductor industry.]]></video:description>
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<video:duration>65</video:duration>
<video:publication_date>2020-07-14T07:15:15+00:00</video:publication_date>
<video:live>no</video:live>
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