CoreFlow’s air floating solution could be integrated into inspection, metrology and other semiconductor process systems, providing consistent and reliable handling of wafers with no contact neither at the back nor front side. When required, Coreflow’s non-contact chuck can clamp the wafer front side when a process on the back side, such as polishing/grinding, is applied.

 

Features

Benefits

High Precision Pressure/Vacuum (PV) contactless technology

Approaching zero back-side contamination

High air-gap stability (±20nm)

High accuracy Inspection

Inherent Damping effect

Eliminates high frequency interferences between chuck & wafer

Low sensitivity to Thermal Expansion

Minimizes contamination-risk

High PV clamping force

  • Enables wafer rotation and lateral handling
  • Flattens warp wafers

 

Coreflow chuck can be applied to any wafer size and is practically orientation free.

 

wafer

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

side info