Driven by the high requirements of wafer handling, CoreFlow addresses the high challenges of reducing back side contamination and handling thin and flexible wafers, for various applications within the semiconductor process.

 

Non-Contact Vacuum Chuck

CoreFlow’s air floating solution integrates into AOI systems, providing consistent and reliable handling of wafers with no contact at the back side.

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

side info